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LEAP 2024: World’s Most-Attended Tech Event Returns to Riyadh with Sharpened Focus on Generative Artificial Intelligence (GAI)

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LEAP 2024

Organisers of LEAP 2024, the seismic technology event conceived to accelerate the adoption of technology and aid the ongoing transformation and diversification of Saudi Arabia’s burgeoning economy, are predicting a record-breaking turnout of more than 172,000 visitors when the multi-award-winning event’s third edition gets underway on March 4 at the Riyadh Exhibition and Convention Center, Malham.

The four-day show, already a key enabler in driving monumental economic development and societal change in Saudi Arabia, will this year sharpen its focus on Generative Artificial Intelligence (GAI). To support this, DeepFest, co-located with LEAP and held in partnership with the Saudi Data & Artificial Intelligence Authority (SDAIA), is back and bigger than ever, with over 120 companies already confirmed to participate. The 2024 edition will unveil government AI initiatives and the latest innovations by incorporating a thought-leadership conference and a series of sector-dedicated tracks, trainings, live demos, innovation sessions, start-up pitches, and an exhibition that features the world’s top tech companies from across the world who are driving AI forward.

Investment and deal generation set to eclipse US$9bn

After the incomparable success of LEAP 2023, where on-event investment deals totalled more than US$9bn, organiser Tahaluf – a joint venture between Informa PLC, the Saudi Federation for Cybersecurity, Programming and Drones (SAFCSP) and Events Investment Fund – predicted LEAP 2024 will continue rewriting tech industry event records.

Organised in partnership with the Saudi Ministry for Communications and Information Technology (MCIT), LEAP 2024 visitor numbers are already on track to surpass the 172,000 attendees achieved last February – a feat that saw LEAP’s second outing confirmed as the world’s most-attended tech event.

Michael Champion, CEO of Tahaluf, said: “In line with our goal to echo the spirit and build on the successes of our previous editions, LEAP 2024 will venture beyond imagined horizons. With a laser focus on AI, its myriad applications, and transformative advancements, LEAP 2024 is a continuation that will catapult the global tech industry into an elevated realm that is overflowing with untapped potential and unique experiences.”

With a new venue to increase capacity, LEAP 2024 will host more than 1,000 exhibitors displaying and demonstrating innovative tech breakthroughs to propel society into new worlds of living and working. An assortment of 1,000-plus international and regional experts will contribute to 25 content tracks, spotlighting next-gen tech frontiers, while seven new content features – dedicated to AI, Sustainability, Gaming, Space, Cybersecurity, Future Workforce, and Digital Twins – complete a robust conference and dynamic knowledge-sharing agenda.

Heavyweight names seize massive sponsor exposure and investment potential

LEAP’s unprecedented business power has generated new sponsorship pacts with some of the world’s leading players. With Ericsson, Huawei, Salam, Family Office, Tawuniya, and Elm already onboard as strategic sponsors, Neo Leap has signed up as a diamond sponsor, while Go Telecom, Lenovo, and Schneider Electric, PwC, and Hong Kong Science and Technology Park are all platinum sponsors. Gold sponsorship agreements have been secured with Mastercard, zoom, Cyberani, Cognizant, Arabsat, Deloitte, Perfect Presentation, and Dinar Investment.

Headline-makers in Main Stage ‘Acts’

A star-studded contingent of 130 headline-making celebrities and C-suite changemakers feature on LEAP’s Main Stage speaker platform, where discussions will follow a four ‘act’ format – Impulse, Accelerate, Momentum, and LEAP – aligned with ideation, business, and personal growth.

“The keynote stage will bring inspiring insights into the exciting evolution of the tech ecosystem and its role in humanity, security, and well-being,” added Champion. “This line-up will feature international tech leaders, global enterprises, policymakers, superstar athletes, and everything in between. Together, they will explore how exponential tech is expanding the social security sector and identify opportunities for shaping digital rights for the wellbeing of this and the next generation.”

Among the confirmed keynote cast to date are Angela Kane, Vice President and former UN High Representative for Disarmament Affairs, International Institute for Peace – Vienna; Elizabeth Adams, Affiliate Fellow and Former Chief AI Ethics and Culture Advisor, Standford Institute for Human-Centered AI; Divya Gokulnath, Co-founder, Byju’s; Martin Vilig, Co-founder, Bolt; Borje Ekholm, CEO and President, Ericsson; Arvind Krishna, CEO, IBM; Martin Urrutia Islas, Global Head of Retail Innovation and Experience, The Lego Group; Philippe Rambach, Chief AI Office, Schneider Electric; Nicholas Dirks, President, The New York Academy of Sciences; Ott Velsberg, Government Chief Data Officer, Republic of Estonia; and Dr Anna Zeiter, VP – Chief Privacy Officer and Associate General Counsel of Privacy, Data and AI at eBay.

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GCC RESIDENTIAL SMART SECURITY MARKET SET TO ADVANCE AS SCREENCHECK PARTNERS WITH BAS-IP

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A ScreenCheck representative and a BAS-IP representative shake hands in front of a display showcasing BAS-IP intercom and security devices, with two additional team members standing beside them at an exhibition booth.

ScreenCheck, a subsidiary of Centena Group and a key player offering end-to-end identification and security solutions in the Middle East, has signed a strategic partnership agreement with global security technologies company, BAS-IP to officially expand its security and identification capabilities into GCC’s residential security market.

The agreement signed during Intersec 2026, aligns with ScreenCheck’s ongoing efforts to establish a robust position in the rapidly growing smart security and digital transformation market. Currently, the market is projected to reach USD 907.12 billion by 2032, growing at a compound annual growth rate of 25.7 per cent between 2025 and 2032. This growth is mainly propelled by large-scale urban development, smart infrastructure investments and surging demand for connected security ecosystems in the residential sector.

Olga Shamilova, Chief Executive Officer at BAS-IP, said: “We are delighted to partner with ScreenCheck and support their entry into this new vertical of security systems. During our participation at Intersec 2026, we witnessed increased interest for our Open API, especially for its ability to create seamless, customised ecosystems and ease to integrate into existing building management systems. Our mobile-first application also received significant attention, as its intuitive interface was proven ideal for both complex multi-apartment projects and luxury private villas. With ScreenCheck’s market expertise in the region and their top tier client base, we look forward to providing a safe and secure environment for communities.”

The collaboration with BAS-IP will address the surging demand from developers for connected home and community security solutions across apartments, gated communities and large residential developments in the region by delivering integrated IP-based audio and video intercom systems combined with access control solutions.

Faisal Mohamed, CEO of ScreenCheck, said: “As cities continue to develop and digital infrastructure becomes an inevitable part of everyday lives, security is equally important for people and systems. We are delighted to work with BAS-IP to serve this evolving market.”

“With the Middle East region experiencing one of the fastest-growing property markets across the globe, our collaboration helps to distribute integrated residential security and home automation solutions. We will be delivering cutting-edge biometric identification, RFID solutions, AI-powered surveillance, and next-generation smart access control to homes, critical infrastructure, and technology-driven enterprises. Our goal is to enable safer, more resilient spaces that highlight the capabilities of the modern security landscape,” added Faisal.

ScreenCheck’s partnership with BAS-IP positions the company at the forefront of the region’s ongoing shift, enabling the delivery of intelligent, connected residential security ecosystems that align with the region’s smart city ambitions and evolving urban landscape.

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VERTIV INTRODUCES NEW MODULAR LIQUID COOLING INFRASTRUCTURE SOLUTION TO SUPPORT HIGH-DENSITY COMPUTE REQUIREMENTS IN NORTH AMERICA AND EMEA

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Isometric 3D rendering of Vertiv prefabricated MegaMod HDX data center module showing integrated liquid cooling skids, power distribution units, racks, piping, and cooling infrastructure arranged within modular enclosures.

Vertiv (NYSE: VRT), a global leader in critical digital infrastructure, today announced new configurations of the Vertiv™ MegaMod™ HDX, a prefabricated power and liquid cooling infrastructure solution engineered for high-density computing environments, including artificial intelligence (AI) and high-performance computing (HPC) deployments. The new configurations give operators flexibility to support rapidly increasing power and cooling requirements while optimizing space and deployment speed. The models are available globally.

Vertiv MegaMod HDX integrates direct-to-chip liquid cooling with air-cooled architectures to meet the intense thermal demands of AI workloads, supporting pod-style AI environments and advanced GPU clusters. The new compact solution has a standard module height and a maximum of 13 racks and power capacity up to 1.25 MW; the combo solution has an extended-height design with a maximum of 144 racks, supporting power capacities up to 10 MW. Both can support rack densities from 50 kW up to more than 100 kW per rack. The hybrid cooling architectures integrate direct-to-chip liquid cooling with air cooling for efficient, high-density thermal management, while the prefabricated modular designs enable accelerated deployment and allow customers to scale their data centers as demand grows.

“Today’s AI workloads demand cooling solutions that go beyond traditional approaches. With the Vertiv MegaMod HDX available in both compact and combo solution configurations, organizations can match their facility requirements while supporting high-density, liquid-cooled environments at scale. Our designs deliver what data centers need most—reliable performance, operational efficiency, and the ability to scale their AI infrastructure with confidence,” said Viktor Petik, senior vice president, infrastructure solutions at Vertiv.

The Vertiv MegaMod HDX models feature innovative hybrid cooling architecture, combining direct-to-chip liquid cooling with adaptable air systems in a fully integrated, prefabricated pod. The solutions feature distributed redundant power architecture enabling continuous operation even if one module goes offline. Additionally, the buffer-tank thermal backup system allows GPU clusters to maintain stable operations during maintenance or load transitions. This factory-integrated design enables repeatable precision in deployment while providing cost certainty for planning and scaling AI infrastructure.

This prefabricated design, combined with factory integrated and fully tested components and Vertiv’s global service network, provide dependable end-to-end support.

Vertiv’s extensive portfolio of power, thermal, and IT management solutions supports a wide range of data center architectures, enabling customers to meet rising density demands with scalable, high-performance infrastructure. Both configurations draw on this broader portfolio, including the Vertiv™ Liebert® APM2 uninterruptible power supply (UPS), Vertiv CoolChip CDU cooling distribution unit, Vertiv PowerBar busway system, and Vertiv™ Unify infrastructure monitoring.

Vertiv also offers IT rack infrastructure designed to seamlessly accommodate and support IT systems, including Vertivracks and Vertiv OCP- compliant racks, Vertiv™ CoolLoop RDHx rear door heat exchanger, Vertiv™ CoolChip in-rack CDU, Vertiv™ rack power distribution units, Vertiv™ PowerDirect in-rack DC power system, and Vertiv™ CoolChip Fluid Network Rack Manifolds.

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HOLCIM UAE JOINS IRENA’S ALLIANCE FOR INDUSTRY DECARBONIZATION (AFID)

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HOLCIM UAE delegation standing with industry stakeholders at the IRENA pavilion during an official alliance announcement event, with IRENA branding displayed in the background.

Holcim has joined the Alliance for Industry Decarbonization (AFID) under the International Renewable Energy Agency (IRENA), reinforcing its commitment to play an active role in shaping the future of low-carbon construction in the UAE and beyond.

Formalized during Abu Dhabi Sustainability Week in January 2026, the membership marks a strategic milestone in Holcim UAE’s evolution from operational decarbonization to sector-wide leadership. Through AFID, Holcim is partnering with a government-led alliance, bringing its established expertise and operational leadership in sustainable building materials and solutions to policy and industry dialogues shaping the future of industrial activity in the UAE.

AFID brings together governments, international organizations, and leading industrial players to accelerate the implementation of technologies and practices across hard-to-abate sectors. Holcim’s participation reflects a deliberate focus on collaboration with policymakers and industry peers, ensuring that regulatory frameworks, investment signals, and technology pathways are informed by real-world industrial experience.

“Industry decarbonization requires practical action at scale, supported by the right policy direction. Joining AFID allows Holcim to engage at that intersection, bringing perspective shaped by practical experience to conversations that matter for the UAE’s low-carbon future,” said Ali Said, CEO of Holcim UAE and Oman.

AFID’s work spans priority areas such as Renewables, Carbon Capture, Utilization, and Storage, Circularity, Green Hydrogen, Human Capital, and Climate-aligned Finance. These focus areas closely align with Holcim’s long-term strategy where sustainability underpins how the business operates, invests, and works with partners across its value chain.

By joining AFID, Holcim reinforces its positioning as a partner focused on contributing to the broader systems and collaborations that will define the future of sustainable construction in the United Arab Emirates and the wider region.

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