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Toshiba Successfully Demonstrates Nearline HDDs with Massive Capacity of Over 30 Terabytes

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Realized with two next-generation large capacity recording technologies: HAMR and MAMR

Toshiba Electronics Europe GmbH announces that Toshiba Electronic Devices & Storage Corporation (Toshiba) has successfully achieved storage capacities of over 30TB with two next-generation large capacity magnetic recording technologies for hard disk drives (HDDs): Heat Assisted Magnetic Recording (HAMR) and Microwave Assisted Magnetic Recording (MAMR). The demonstration drives represent a major milestone in the advance towards commercial products based on each of these emerging recording formats.

HAMR boosts writing capabilities by locally heating the disk material with a near-field laser. Toshiba achieved 32TB on 10 disks using Shingled Magnetic Recording (SMR) – a technology that partially overlaps data tracks to increase the areal density and overall storage capacity per X disk. Toshiba plans to start shipping test sample HDDs of 28 – 30TB with HAMR technology in 2025.

The other technology is MAMR, which uses microwaves to enhance magnetic recording capabilities. Toshiba was the first to demonstrate its effectiveness and started mass production of first-generation drives in 2021. Toshiba achieved 31TB capacity by stacking 11 disks, using SMR technology, and improving signal processing.

These new achievements were made possible through years of close collaborative work with Resonac Corporation, an HDD media manufacturer, and TDK Corporation, a HDD head manufacturer. Toshiba and its working partners are committed to continue developing both HAMR and MAMR technologies to provide higher capacity HDDs to meet the growing storage demand of the cloud and datacenters.

As Larry Martinez-Palomo, Vice President, Head of Storage Products Division at Toshiba, explains: “Toshiba is concurrently advancing the development of future generation high-capacity HDDs using both HAMR and MAMR technologies. Mass production of hard disk drives incorporating HAMR will commence after the validation phase is completed. In the interim, Toshiba will continue to satisfy the demand for high-capacity, high-reliability storage devices with hard disk drives employing the field-proven MAMR technology.”

At ISC High Performance 2024, May 12th to 16th in Hamburg, Germany, Toshiba and its partners will discuss with experts, how its hard disk drive technologies and enterprise portfolio are streamlined to meet the needs of large and fast online backend storage. On the stand (G02), there will be a live demo showing the astonishing performance of Toshiba’s HDD MG Series.

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Huawei Showcases 5G-Advanced and AI Integration at MWC Shanghai 2024

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Huawei made a significant impact at the Mobile World Congress (MWC) Shanghai 2024, highlighting its advancements in 5G-Advanced (5G-A) technology and artificial intelligence (AI) integration. Under the theme “Advancing the Intelligent World,” the company presented a comprehensive vision for the future of mobile networks and services.

The year 2024 marks the commercial launch of 5G-A, with leading operators in the Middle East already deploying 5G-A networks. Huawei showcased its latest products and solutions supporting both 5G-A deployment and AI devices required for the mobile AI era.

Huawei’s Executive Director David Wang emphasized how 5G-A and AI devices will be key to making intelligent services ubiquitous, transforming human-machine interaction, content production, and mobile devices. Wang noted that the number of global 5G users has exceeded 1.8 billion, with many operators seeing the first wave of benefits. The company highlighted that nearly 20 mobile phone models currently support multi-carrier aggregation, with some activating the feature by default. Multiple operators in the Middle East and China have started deploying 5G-A three-carrier component (3CC) aggregation networks at scale, targeting 5 Gbit/s downlink rates.

In a significant industry initiative, Huawei launched the 5G-A Pioneers Program, reaching six consensuses with pioneering global operators, including UAE’s du, Oman Telecommunications, China’s “big three”, and HKT. These consensuses aim to maximize the value of advanced 5G-A capabilities, promote its development, and further advance the industry through various focus areas, including Pioneer Operators, Pioneer Cities, Business Model Upgrade, High-quality Networks, Service Innovation, and Thriving Ecosystems.

Huawei also unveiled plans to bring AI to networks, focusing on building an ecosystem of RAN Intelligent Agent in collaboration with operators. This initiative aims to increase network productivity by reshaping network operations and maintenance (O&M), experience, and services. Towards this end, Huawei introduced AI-powered copilots and agents to support role-based chatbots and scenario-based solution automation, significantly improving efficiency in areas such as field maintenance and network optimization.

Huawei introduced the Open Gateway initiative to help carriers monetize their 5G investments. Huawei’s Chief Marketing Officer, Dr. Philip Song, presented successful use cases of global operators that have improved customer services and lowered time to market.

Yang Chaobin, Huawei’s Board Member and President of ICT Products & Solutions, introduced the company’s upgraded Autonomous Driving Network (ADN) solution. Powered by Huawei’s Telecom Foundation Model, this solution provides five role-based copilots and five scenario-based agents, enhancing the value of networks in service enablement, network maintenance, and experience assurance.

As the industry moves into the 5G-A era, Huawei emphasized its commitment to collaborating with global operators and industry stakeholders. The company aims to accelerate 5G-A development from both the ‘Networks for AI’ and ‘AI for Networks’ perspectives, creating new business value and shaping the intelligent world.

Huawei also announced the launch of a joint initiative for high-quality mobile video development in the AI era, alongside global operators, industry customers, and other relevant organizations. The company plans to discuss development paths for F5G-A and Net5.5G with industry players over the coming days.

Huawei also joined the ICT Policy and Governance Forum convened by the GSMA on the sidelines of MWC Shanghai 2024. This forum, centered on the theme of “Driving Policy and Innovation to Shape Our Digital Future,” provided a platform for regulators, operators, and industry leaders from the Middle East, North Africa, Central Asia, and China to exchange insights on key trends and successful practices in the telecommunications sector. Huawei’s presence at MWC Shanghai 2024 underscored its leadership in driving the convergence of 5G-Advanced and AI technologies, setting the stage for a new era of intelligent, high-performance mobile networks and services.

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Esports World Cup and HONOR Sign Technology Partnership for Mobile Competitions

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The Esports World Cup Foundation and HONOR have announced a main partnership for the Esports World Cup, set to take place this summer in Riyadh, Saudi Arabia. The HONOR 200 Pro will be the official smartphone of the EWC, leveraging the device’s cutting-edge technology to power esports competitions in popular mobile games like Free Fire, Honor of Kings and Women’s ML:BB tournament.

As the ultimate smartphone for mobile gaming enthusiasts, the HONOR 200 Pro offers a suite of outstanding new features that appeal to both esports athletes and casual players. Highlights include:

  • ● Snapdragon 8 Series Mobile Platform: Boasting a CPU clock speed of up to 3GHz for smooth graphics rendering and real-time responsiveness.
  • ● 5200mAh Silicon-Carbon Battery: Providing up to 61 hours of use on a single charge.
  • ● 3840Hz Risk-Free Dimming: Verified by TÜV Rheinland Flicker Free Display Certification and TÜV Rheinland Full Care Display Certification, with Natural Tone 2.0 for optimized display color temperature.
  • ● Advanced Cooling: A vapor chamber covering 36,881mm², 10% larger than the HONOR 90, for exceptional heat dissipation.

The partnership will focus on engaging global gamers, strengthening brand identities, and fostering a community driven by the spirit of competition.

“We are thrilled to join forces with as a partner in the Esports World Cup,” exclaimed CEO Ralf Reichert at the Esports World Cup Foundation. “EWC athletes demand the absolute best in gaming technology, as it is essential for maintaining competitive integrity and delivering an unparalleled experience. The HONOR 200 Pro is an exceptional smartphone, equipped with cutting-edge technology that surpasses the high standards set by EWC athletes. We are eager to witness its incredible performance this summer in Riyadh.”

“HONOR is very pleased to join forces with the Esports World Cup and provide the official smartphone for its mobile competitions,” said Dr. Ray, CMO of HONOR. “As a brand dedicated to its consumers, HONOR strives to offer products that provide a superior experience and elevated performance, particularly among gamers. Our technology enables players to push their limits and achieve new heights in their gaming journey. We look forward to seeing the HONOR 200 Pro power the best esports athletes in the world as they strive for international greatness at the Esports World Cup.”

Beginning July 3, the Esports World Cup will transform Riyadh into the epicenter of esports fandom and gaming culture. Located in Boulevard City, fans can watch their favorite athletes and clubs compete across 22 game championships for a share of more than $60 million in life-changing prize money — the largest prize pool in esports history. Across eight weeks, the Esports World Cup will also feature festival activities that include numerous gaming activations, community tournaments, pop culture celebrations, international experiences, and more.

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Toshiba Announces MG10-D Series of Enterprise HDDs with Capacities up to 10TB

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Toshiba Electronics Europe GmbH (Toshiba) announces the release of its MG10-D Series, a family of air-filled conventional magnetic recording (CMR) HDDs supporting SAS and SATA interfaces and capacities of up to 10TB. Crafted with precision engineering and over 50 years of Toshiba experience, the MG10-D Series delivers improved performance and power efficiency over prior generations. With sanitize instant erase (SIE) and self-encrypting drive (SED) options, valuable data is safeguarded by a storage solution known for its robust performance and unwavering dependability.

Built for the increasing application demands of enterprise server and storage solutions, the MG10-D Series delivers a new level of performance. For example, compared with the previous model, the new 10TB MG10ADA10TE provides an approximately 13% better maximum sustained transfer speed of 268MiB/s and doubles the cache buffer size to 512MiB. It also reduces power consumption in active idle mode by approximately 21%, to 5.74W. Architected to deliver improved total cost of ownership (TCO), the new MG10-D Series fits seamlessly into a wide variety of business-critical applications, such as email, data analytics, data retention, and surveillance.

“Toshiba’s MG10-D Series delivers exceptional performance to meet the demands of growing business critical applications. The new cutting-edge design of the MG10-D Series is engineered for sustainable enterprise environments and fits seamlessly into existing infrastructure reducing TCO,” said Larry Martinez-Palomo, Vice President, Head of Storage Products Division at Toshiba.

The MG10-D Series is a 5-disk CMR standard 3.5-inch, 7200 RPM air-filled platform. Available capacities are 2TB, 4TB, 6TB, 8TB, and 10TB for both SAS and SATA. SATA is also available in a 1TB drive. The series supports 6Gb/s SATA or 12Gb/s SAS interface options in Advanced format 512e and 4Kn. A 512n option is available on the 1TB, 2TB, and 4TB offerings to support legacy systems with native 512 byte block sizes. Designed for 24×7 enterprise reliability, the MG10-D Series has a workload rating of 550TB, an AFR of 0.44% and an MTTF/MTBF of 2M hours.

The MG10-D Series will be available in CQ3.

MG10-D Series

CapacityInterfaceFormatModel NumberOptional Security
10 TBSATA-3.3512e/4Kn [7]MG10ADA10TESIE/SED[2]
8 TBMG10ADA800E
6 TBMG10ADA600E
4 TBMG10ADA400E
2 TBMG10ADA200E
4 TB512nMG10ADA400N
2 TBMG10ADA200N
1 TBMG10ADA100N
10 TBSAS-3.0512e/4Kn [7]MG10SDA10TE
8 TBMG10SDA800E
6 TBMG10SDA600E
4 TBMG10SDA400E
2 TBMG10SDA200E
4 TB512nMG10SDA400N
2 TBMG10SDA200N
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