Tech News
du elevates brand strength to historic highs, climbing the ranks as a global top 25 telecom powerhouse
du climbs to the 3rd strongest brand in the UAE and 7th in the Middle East, with a brand value growth of 13% to $2.47 billion, showcasing its enhanced market position and branding excellence.
du, an Emirates Integrated Telecommunications Company (EITC), reached a significant milestone in its brand strength, according to the 2024 Brand Finance rankings. Achieving a brand strength index (BSI) of 82.5 points, the company has not only maintained its AAA- rating but has also risen to become the 3rd strongest brand in the UAE and 7th in the Middle East. This notable growth has elevated du into the Global Top 25 Telecom brands, from its previous position at 33rd last year.
The company’s strategic initiatives and consistent focus on innovative telecommunications solutions have significantly increased its brand value by 13% year-on-year, from $2.198 billion to an impressive $2.475 billion. This marks not only a significant increase in financial valuation but also reinforces du’s ongoing commitment to excellence and innovation in the competitive telecom sector.
Fahad Al Hassawi, CEO at du, said: “The du vision, which underpins our strategy to deliver value and unmatched experiences to our customers, has fortified our brand against both local and international benchmarks. Our strategic efforts have elevated our status to the 7th strongest entity in the Middle East telecom sector, further highlighting our prominence among the Global Top 25 Telecom brands. Keeping pace with generational and market developments, we have continuously adapted our approach to enhance customer satisfaction in alignment with our brand ethos.”
The surge in brand strength and value is driven by du’s proactive approach in integrating cutting-edge technologies and customer-centric services, which significantly enhance user experiences. The ranking is also attributed to du’s enhanced brand strength across various index attributes, including the quality of our products combined with value for money and innovative methods to address customers’ needs. positioning the company as a joint leader in these domains. The company’s recent initiatives in expanding 5G capabilities and enhancing digital transformation services have set benchmarks within the industry.
Tech News
GCC RESIDENTIAL SMART SECURITY MARKET SET TO ADVANCE AS SCREENCHECK PARTNERS WITH BAS-IP
ScreenCheck, a subsidiary of Centena Group and a key player offering end-to-end identification and security solutions in the Middle East, has signed a strategic partnership agreement with global security technologies company, BAS-IP to officially expand its security and identification capabilities into GCC’s residential security market.
The agreement signed during Intersec 2026, aligns with ScreenCheck’s ongoing efforts to establish a robust position in the rapidly growing smart security and digital transformation market. Currently, the market is projected to reach USD 907.12 billion by 2032, growing at a compound annual growth rate of 25.7 per cent between 2025 and 2032. This growth is mainly propelled by large-scale urban development, smart infrastructure investments and surging demand for connected security ecosystems in the residential sector.
Olga Shamilova, Chief Executive Officer at BAS-IP, said: “We are delighted to partner with ScreenCheck and support their entry into this new vertical of security systems. During our participation at Intersec 2026, we witnessed increased interest for our Open API, especially for its ability to create seamless, customised ecosystems and ease to integrate into existing building management systems. Our mobile-first application also received significant attention, as its intuitive interface was proven ideal for both complex multi-apartment projects and luxury private villas. With ScreenCheck’s market expertise in the region and their top tier client base, we look forward to providing a safe and secure environment for communities.”
The collaboration with BAS-IP will address the surging demand from developers for connected home and community security solutions across apartments, gated communities and large residential developments in the region by delivering integrated IP-based audio and video intercom systems combined with access control solutions.
Faisal Mohamed, CEO of ScreenCheck, said: “As cities continue to develop and digital infrastructure becomes an inevitable part of everyday lives, security is equally important for people and systems. We are delighted to work with BAS-IP to serve this evolving market.”
“With the Middle East region experiencing one of the fastest-growing property markets across the globe, our collaboration helps to distribute integrated residential security and home automation solutions. We will be delivering cutting-edge biometric identification, RFID solutions, AI-powered surveillance, and next-generation smart access control to homes, critical infrastructure, and technology-driven enterprises. Our goal is to enable safer, more resilient spaces that highlight the capabilities of the modern security landscape,” added Faisal.
ScreenCheck’s partnership with BAS-IP positions the company at the forefront of the region’s ongoing shift, enabling the delivery of intelligent, connected residential security ecosystems that align with the region’s smart city ambitions and evolving urban landscape.
Tech News
VERTIV INTRODUCES NEW MODULAR LIQUID COOLING INFRASTRUCTURE SOLUTION TO SUPPORT HIGH-DENSITY COMPUTE REQUIREMENTS IN NORTH AMERICA AND EMEA
Vertiv (NYSE: VRT), a global leader in critical digital infrastructure, today announced new configurations of the Vertiv™ MegaMod™ HDX, a prefabricated power and liquid cooling infrastructure solution engineered for high-density computing environments, including artificial intelligence (AI) and high-performance computing (HPC) deployments. The new configurations give operators flexibility to support rapidly increasing power and cooling requirements while optimizing space and deployment speed. The models are available globally.
Vertiv MegaMod HDX integrates direct-to-chip liquid cooling with air-cooled architectures to meet the intense thermal demands of AI workloads, supporting pod-style AI environments and advanced GPU clusters. The new compact solution has a standard module height and a maximum of 13 racks and power capacity up to 1.25 MW; the combo solution has an extended-height design with a maximum of 144 racks, supporting power capacities up to 10 MW. Both can support rack densities from 50 kW up to more than 100 kW per rack. The hybrid cooling architectures integrate direct-to-chip liquid cooling with air cooling for efficient, high-density thermal management, while the prefabricated modular designs enable accelerated deployment and allow customers to scale their data centers as demand grows.
“Today’s AI workloads demand cooling solutions that go beyond traditional approaches. With the Vertiv MegaMod HDX available in both compact and combo solution configurations, organizations can match their facility requirements while supporting high-density, liquid-cooled environments at scale. Our designs deliver what data centers need most—reliable performance, operational efficiency, and the ability to scale their AI infrastructure with confidence,” said Viktor Petik, senior vice president, infrastructure solutions at Vertiv.
The Vertiv MegaMod HDX models feature innovative hybrid cooling architecture, combining direct-to-chip liquid cooling with adaptable air systems in a fully integrated, prefabricated pod. The solutions feature distributed redundant power architecture enabling continuous operation even if one module goes offline. Additionally, the buffer-tank thermal backup system allows GPU clusters to maintain stable operations during maintenance or load transitions. This factory-integrated design enables repeatable precision in deployment while providing cost certainty for planning and scaling AI infrastructure.
This prefabricated design, combined with factory integrated and fully tested components and Vertiv’s global service network, provide dependable end-to-end support.
Vertiv’s extensive portfolio of power, thermal, and IT management solutions supports a wide range of data center architectures, enabling customers to meet rising density demands with scalable, high-performance infrastructure. Both configurations draw on this broader portfolio, including the Vertiv™ Liebert® APM2 uninterruptible power supply (UPS), Vertiv™ CoolChip CDU cooling distribution unit, Vertiv™ PowerBar busway system, and Vertiv™ Unify infrastructure monitoring.
Vertiv also offers IT rack infrastructure designed to seamlessly accommodate and support IT systems, including Vertiv™ racks and Vertiv™ OCP- compliant racks, Vertiv™ CoolLoop RDHx rear door heat exchanger, Vertiv™ CoolChip in-rack CDU, Vertiv™ rack power distribution units, Vertiv™ PowerDirect in-rack DC power system, and Vertiv™ CoolChip Fluid Network Rack Manifolds.
Tech News
HOLCIM UAE JOINS IRENA’S ALLIANCE FOR INDUSTRY DECARBONIZATION (AFID)
Holcim has joined the Alliance for Industry Decarbonization (AFID) under the International Renewable Energy Agency (IRENA), reinforcing its commitment to play an active role in shaping the future of low-carbon construction in the UAE and beyond.
Formalized during Abu Dhabi Sustainability Week in January 2026, the membership marks a strategic milestone in Holcim UAE’s evolution from operational decarbonization to sector-wide leadership. Through AFID, Holcim is partnering with a government-led alliance, bringing its established expertise and operational leadership in sustainable building materials and solutions to policy and industry dialogues shaping the future of industrial activity in the UAE.
AFID brings together governments, international organizations, and leading industrial players to accelerate the implementation of technologies and practices across hard-to-abate sectors. Holcim’s participation reflects a deliberate focus on collaboration with policymakers and industry peers, ensuring that regulatory frameworks, investment signals, and technology pathways are informed by real-world industrial experience.
“Industry decarbonization requires practical action at scale, supported by the right policy direction. Joining AFID allows Holcim to engage at that intersection, bringing perspective shaped by practical experience to conversations that matter for the UAE’s low-carbon future,” said Ali Said, CEO of Holcim UAE and Oman.
AFID’s work spans priority areas such as Renewables, Carbon Capture, Utilization, and Storage, Circularity, Green Hydrogen, Human Capital, and Climate-aligned Finance. These focus areas closely align with Holcim’s long-term strategy where sustainability underpins how the business operates, invests, and works with partners across its value chain.
By joining AFID, Holcim reinforces its positioning as a partner focused on contributing to the broader systems and collaborations that will define the future of sustainable construction in the United Arab Emirates and the wider region.
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